Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

DARPA posted this STTR topic. It takes Phase II proposals until October 21, 2026.

Topic: DPA26TZ06-DV004
Call: DoW STTR 2026 BAA
Agency: Department of Defense, DARPA

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From the topic

Develop and demonstrate novel nanofabrication hard-mask materials that exhibit substantially improved plasma etch resistance, enabling the implementation of extreme high-aspect-ratio structures with excellent pattern-transfer fidelity, minimal sidewall roughness, and precise dimensional control.

Objective, as posted by the agency

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